IC KA2132

Pin Details of IC KA2132

Substitute : TDA1044

Functions :
1. Vertical oscilator
2Vertical output
3.Geometrical Distortion circiut
4.Feedback circuit
5.Vertical blangking


Pin No.FuctionsVoltage
1.Geometrical distortion circuit to improve vertical linierty3.4
2.Feedback(output to input negatif feedback circuit)3.8
3.Feedback(output to input negatif feedback circuit)0.8
4.50 Hz. Frequency output to to vertical deflection coil6
5.Positif supply to final vertical ampli. or vertical output18
6.Vertical blanking generator(vertical blanking pulses)(50Hz)1
7.Positif supply from sync separator18
8.Vertical sync input(50Hz.)from sync separator0
9.N C in the CircuitNC
10.Vertical; oscilator (Linier saw tooth generator)(50Hz.)1
11.Linier saw tooth generator control or vertical Hold6
12.Supply for linier saw tooth generator or vertical oscilator supply7


IC AN 5512

Pin Details of IC KA A2131

Subsitute :AN 5512

Function :
1.Vertical Driver
2.Vertical output
3.Flyback generator or blanking oscillator

Pin No Functions voltage
1. Grouns(- Ve supply voltage ) 0
2. Vertical signal output to deflection coil(50 Hz ) 10.2
3 Not connected -
4. Positive supply (+Ve) for vertical output section 20
5. Drive transisor collector -
6. Feedback (output to input ) to improve vertical linearity 0.73
7. Vertical blanking pulse (50Hz)to flyback generator 0.1
8. Vertical blanking output(pulse ampli.output) 1.3
9. (+Ve)(Main supply to IC) 20


Manufacturing an Integrated Circuit

Manufacturing an Integrated Circuit
By Craig R. Barrett


The fundamental device of the digital world is the integrated circuit, a small square of silicon containing millions of transistors. It is probably the most complex of man-made products. Although it looks flat, it is in fact a three-dimensional structure made by painstakingly building up on the silicon base several microscopically thin layers of materials that both insulate and conduct electricity. Assembled according to a pattern carefully worked out in advance, these layers form the transistors, which function as switches controlling the flow of electricity through the circuit, which is also known as a chip. 'On' and 'off' switches manipulate the binary code that is at the core of what a computer does.
Building a chip typically requires several hundred manufacturing steps that take weeks to complete. Each step must be executed perfectly if the chip is to work. The conditions are demanding. For example, because a speck of dust can ruin a chip, the manufacturing has to be done in a 'clean room' containing less than one submicron particle of dust per cubic foot of air (in contrast, the average living room has between 100,000 and one million particles per cubic foot of air). Much of the equipment needed for making chips embodies the highest of high technology, with the result that chip factories—which cost between $1 billion and $2 billion for a state-of-the-art facility—are among the costliest of manufacturing plants.
A basic technology of chipmaking is the 'planar' process devised in 1957 by Jean Hoerni of Fairchild Semiconductor. It provided a means of creating a layered structure on the silicon base of a chip. This technology was pivotal in Robert N. Noyce's development of the integrated circuit in 1958. (Noyce later became co-founder with Gordon E. Moore of Intel Corporation, the company that invented the microprocessor and has become the world's leading supplier of semiconductor chips.…) Bridging the gap between the transistor and the integrated circuit, the planar technology opened the way to the manufacturing process that now produces chips. The hundreds of individual steps in that process can be grouped into a few basic operations.
Chip Design
The first operation is the design of the chip. When tens of millions of transistors are to be built on a square of silicon about the size of a child's fingernail, the placing and interconnections of the transistors must be meticulously worked out. Each transistor must be designed for its intended function, and groups of transistors are combined to create circuit elements such as inverters, adders and decoders. The designer must also take into account the intended purpose of the chip. A processor chip carries out instructions in a computer, and a memory chip stores data. The two types of chips differ somewhat in structure. Because of the complexity of today's chips, the design work is done by computer, although engineers often print out an enlarged diagram of a chip's structure to examine it in detail.

The Silicon Crystal
The base material for building an integrated circuit is a silicon crystal. Silicon, the most abundant element on the earth except for oxygen, is the principal ingredient of beach sand. Silicon is a natural semiconductor, which means that it can be altered to be either an insulator or a conductor. Insulators, such as glass, block the passage of electricity; conductors, such as copper, let electricity pass through. To make a silicon crystal, raw silicon obtained from quartz rock is treated with chemicals that remove contaminants until what remains is almost 100 percent silicon. This purified silicon is melted and then formed into cylindrical single crystals called ingots. The ingots are sliced into wafers about 0.725 millimeter (0.03 inch) thick. In a step called planarization they are polished with a slurry until they have a flawless, mirror-smooth surface. At present, most of the wafers are 200 millimeters (eight inches) in diameter, but the industry is moving toward achieving a standard diameter of 300 millimeters (12 inches) by 1999. Because a single wafer yields hundreds of chips, bigger wafers mean that more chips can be made at one time, holding down the cost per chip.
The First Layers
With the wafer prepared, the process of building the chip's circuitry begins. Making the transistors and their interconnections entails several different basic steps that are repeated many times. The most complex chips made today consist of 20 or more layers and may require several hundred separate processing steps to build them up one by one.
The first layer is silicon dioxide, which does not conduct electricity and therefore serves as an insulator. It is created by putting the wafers into a diffusion furnace —essentially an oven at high temperature where a thin layer of oxide is grown on the wafer surface.
Removed from the furnace, the wafer is now ready for its first patterning, or photolithographic, step. A coating of a fairly viscous polymeric liquid called photoresist, which becomes soluble when it is exposed to ultraviolet light, is applied to the surface. A spigot deposits a precise amount of photoresist on the wafer surface. Then the wafer is spun so that centrifugal force spreads the liquid over the surface at an even thickness. This operation takes place on every layer that is modified by a photolithographic procedure called masking, described in the next step.

Masking
A mask is the device through which ultraviolet light shines to define the circuit pattern on each layer of a chip. Because the pattern is intricate and must be positioned precisely on the chip, the arrangement of opaque and transparent spaces on a mask must be done carefully during a chip's design stage.
The mask image is transferred to the wafer using a computer-controlled machine known as a stepper. It has a sophisticated lens system to reduce the pattern on the mask to the microscopic dimensions of the chip's circuitry, requiring resolution as small as 0.25 micron. The wafer is held in place on a positioning table below the lens system. Ultraviolet light from an arc lamp or a laser shines through the clear spaces of the mask's intricate pattern onto the photoresist layer of a single chip. The stepper table then moves the wafer the precise distance required to position another chip under the light. On each chip, the parts of the photoresist layer that were struck by the light become soluble and can be developed, much like photographic film, using organic solvents. Once the photoresist is patterned, the wafer is ready for etching.

Etching
During this step, photoresist remaining on the surface protects parts of the underlying layer from being removed by the acids or reactive gases used to etch the pattern on the surface of the wafer. After etching is complete, the protective layer of photoresist is removed to reveal electrically conducting or electrically insulating segments in the pattern determined by the mask. Each additional layer put on the chip has a distinctive pattern of this kind.

Adding Layers
Further masking and etching steps deposit patterns of additional materials on the chip. These materials include polysilicon as well as various oxides and metal conductors such as aluminum and tungsten. To prevent the formation of undesired compounds during subsequent steps, other materials known as diffusion barriers can also be added. On each layer of material, masking and etching create a unique pattern of conducting and nonconducting areas. Together these patterns aligned on top of one another form the chip's circuitry in a three-dimensional structure. But the circuitry needs fine-tuning to work properly. The tuning is provided by doping.
Doping
Doping deliberately adds chemical impurities, such as boron or arsenic, to parts of the silicon wafer to alter the way the silicon in each doped area conducts electricity. Machines called ion implanters are often used to inject these impurities into the chip.
In electrical terms, silicon can be either n-type or p-type, depending on the impurity added. The atoms in the doping material in n-type silicon have an extra electron that is free to move. Some of the doping atoms in p-type silicon are short an electron and so constitute what is called a hole. Where the two types adjoin, the extra electrons can flow from the n-type to the p-type to fill the holes.
This flow of electrons does not continue indefinitely. Eventually the positively charged ions left behind on the n-type side and the negatively charged ions on the p-type side together create an electrical force that prevents any further net flow of electrons from the n-type to the p-type region.
The material at the base of the chip is p-type silicon. One of the etching steps in the manufacture of a chip removes parts of the polysilicon and silicon dioxide layers put on the pure silicon base earlier, thus laying bare two strips of p-type silicon. Separating them is a strip that still bears its layer of conducting polysilicon; it is the transistor's 'gate.' The doping material now applied to the two strips of p-type silicon transforms them into n-type silicon. A positive charge applied to the gate attracts electrons below the gate in the transistor's silicon base. These electrons create a channel between one n-type strip (the source) and the other (the drain). If a positive voltage is applied to the drain, current will flow from source to drain. In this mode, the transistor is 'on.' A negative charge at the gate depletes the channel of electrons, thereby preventing the flow of current between source and drain. Now the transistor is 'off.' It is by means of switching on and off that a transistor represents the arrays of 1 and 0 that constitute the binary code, the language of computers.
Done many times in many layers, these operations provide the chip with its multitude of transistors. But just as provision must be made to run electrical wires and plumbing pipes between floors of a building, provision must be made in chips for interconnecting the transistors so they form an integrated circuit.

Interconnections
This final step begins with further masking and etching operations that open a thin layer of electrical contacts between layers of the chip. Then aluminum is deposited and patterned using photolithography to create a form of wiring that links all the chip's transistors. Aluminum is chosen for this application because it makes good electrical contact with silicon and also bonds well to silicon dioxide.
This step completes the processing of the wafer. Now the individual chips are tested to ensure that all their electrical connections work using tiny electrical probes. Next, a machine called a dicer cuts up the wafer into individual chips, and the good chips are separated from the bad. The good chips—usually most of the wafer's crop—are mounted onto packaging units with metal leads. Wire bonders then attach these metal leads to the chips. The electrical contacts between the chip's surface and the leads are made with tiny gold or aluminum wires about 0.025 millimeter (0.001 inch) in diameter. Once the packaging process is complete, the finished chips are sent to do their digital work.

Antenna Frequency

Frequency

Frequency, term used in the physical sciences to denote the number of times that any regularly recurring phenomenon occurs in one second. Frequency is important in many fields of science, such as mechanics, and the study of sound waves.
Frequencies of oscillating objects can cover a wide range of values. The tremors of earthquakes may have a frequency of less than 1, while the rapid electromagnetic oscillations of gamma rays may have frequencies of 1020 or more. In almost all forms of mechanical vibration, a relationship exists between frequency and the physical dimensions of the vibrating object. Thus, the time required by a pendulum to make one complete swing is partly determined by the length of the pendulum; the frequency or speed of vibration of a string of a musical instrument is partly determined by the length of the string. In each instance, the shorter the object, the higher the frequency of vibration.
In wave motion of all kinds, the frequency of the wave is usually given in terms of the number of wave crests that pass a given point in a second. The velocity of the wave and its frequency and wavelength are interrelated. The wavelength (the distance between successive wave crests) is inversely proportional to frequency and directly proportional to velocity. In mathematical terms, this relationship is expressed by the equation V = ? f, where V is velocity, f is frequency, and ? is wavelength. From this equation any one of the three quantities can be found if the other two are known.
Frequency is expressed in hertz (Hz); a frequency of 1 Hz means that there is 1 cycle or oscillation per second. The unit is named in honor of the German physicist Heinrich Rudolf Hertz, who first demonstrated the nature of electromagnetic wave propagation. Kilohertz (kHz), or thousands of cycles per second, megahertz (MHz), or millions of cycles per second, and gigahertz (GHz), or billions of cycles per second, are employed in describing certain high-frequency phenomena, such as radio waves. Radio waves and other types of electromagnetic radiation may be characterized either by their wavelengths, or by their frequencies. Electromagnetic waves of extremely high frequencies, such as light and X rays, are usually described in terms of their wavelength measure, which is often expressed in angstrom units (Å; hundred-millionths of a cm). An electromagnetic wave that has a wavelength of 1 Å has a frequency of about 3 billion GHz.
See Sound; Ultrasonics; Wave Motion.

Antenna Electromagnetic Radiation

Electromagnetic Radiation

1. INTRODUCTION

Electromagnetic Radiation, energy waves produced by the oscillation or acceleration of an electric charge. Electromagnetic waves have both electric and magnetic components. Electromagnetic radiation can be arranged in a spectrum that extends from waves of extremely high frequency and short wavelength to extremely low frequency and long wavelength (see Wave Motion). Visible light is only a small part of the electromagnetic spectrum. In order of decreasing frequency, the electromagnetic spectrum consists of gamma rays, hard and soft X rays, ultraviolet radiation, visible light, infrared radiation, microwaves, and radio waves.

2. PROPERTIES

There are three phenomena through which energy can be transmitted: electromagnetic radiation, conduction, and convection (see Heat Transfer). Unlike conduction and convection, electromagnetic waves need no material medium for transmission. Thus, light and radio waves can travel through interplanetary and interstellar space from the sun and stars to the earth. Regardless of the frequency, wavelength, or method of propagation, electromagnetic waves travel at a speed of 3 × 1010 cm (186,272 mi) per second in a vacuum. All the components of the electromagnetic spectrum, regardless of frequency, also have in common the typical properties of wave motion, including diffraction and interference. The wavelengths range from millionths of a centimeter to many kilometers. The wavelength and frequency of electromagnetic waves are important in determining heating effect, visibility, penetration, and other characteristics of the electromagnetic radiation.

3.THEORY

British physicist James Clerk Maxwell laid out the theory of electromagnetic waves in a series of papers published in the 1860s. He analyzed mathematically the theory of electromagnetic fields and predicted that visible light was an electromagnetic phenomenon.

Physicists had known since the early 19th century that light is propagated as a transverse wave (a wave in which the vibrations move in a direction perpendicular to the direction of the advancing wave front). They assumed, however, that the wave required some material medium for its transmission, so they postulated an extremely diffuse substance, called ether, as the unobservable medium. Maxwell's theory made such an assumption unnecessary, but the ether concept was not abandoned immediately, because it fit in with the Newtonian concept of an absolute space-time frame for the universe. A famous experiment conducted by the American physicist Albert Abraham Michelson and the American chemist Edward Williams Morley in the late 19th century served to dispel the ether concept and was important in the development of the theory of relativity. This work led to the realization that the speed of electromagnetic radiation in a vacuum is an invariant.

4. QUANTA OF RADIATION

At the beginning of the 20th century, however, physicists found that the wave theory did not account for all the properties of radiation. In 1900 the German physicist Max Planck demonstrated that the emission and absorption of radiation occur in finite units of energy, known as quanta. In 1904, German-born American physicist Albert Einstein was able to explain some puzzling experimental results on the external photoelectric effect by postulating that electromagnetic radiation can behave like a particle (see Quantum Theory).

Other phenomena, which occur in the interaction between radiation and matter, can also be explained only by the quantum theory. Thus, modern physicists were forced to recognize that electromagnetic radiation can sometimes behave like a particle, and sometimes behave like a wave. The parallel concept—that matter also exhibits the same duality of having particlelike and wavelike characteristics—was developed in 1923 by the French physicist Louis Victor, Prince de Broglie.



Pin Details of IC KA 2130

Pin Details of IC KA 2130

Substitute : µPC1031, TA7242, LA1385

Functions :

  1. Vert.oscillator
  2. Vert. output
  3. Vert. blanking generator
  4. Vert. sync amplifier
Pin No Functions Voltage
1. Vertical output(50Hz.)to vertical deflection coil 9
2. Positive (+Ve)supply for IC output section 18
3. Vertical output(50Hz.)to vertical deflection coil 16
4. 50Hz.output from vert.oscillator and vert.sync amplifier(height control) 15
5. Vertical sync input(50Hz.)from sync separator 1.2
6. Vertical frequency (50Hz.)adjustment(vert.hold) 4
7. 50Hz.input for vertical output stage(internally) 5.1
8. Ground (-Ve)supply voltage 0
9. Feedback(output to input)to inprove vertical linearity 9
10 Positive (+Ve)supply for terminal for IC (main supply to IC ) 18



IC KA 2105

Pin Details of IC KA 2105

Substitute : TA 7337

Functions : Sound IF amplifier and FM detector

Pin No Functions Voltage
1. Ground (-Ve)supply terminal 0
2. 5.5MHz. Inter-carrier sound input(SIF input) 1.9
3. 5.5MHz. Inter-carrier sound input(SIF input) 1.9
4. Positive (+Ve)supply voltage 11.5
5. Ground (-Ve)supply voltage 0
6. FM detector (SIF detector coil) 4.4
7. FM detector (SIF detector coil) 3.8
8. Decoupling capacitor 6.8
9. Audio freuency output 5.1



Pin details of IC KA 2101

Pin details of IC KA 2101

Substitute : CA3065, AN241, TA7176AP, HA1125, LA1365, LM3065, MC1358, ULN2165

Functions : Sound IF amplifier limiter,low pass filter, FM detector and AF amplifier

Pin No Functions Voltage
1. Sound IF input (5.5 MHz. inter carrier sound) 1.9
2. Sound IF input (5.5 MHz. inter carrier sound) 1.9
3. Sound IF ground 0
4. Ground(-Ve)supply voltage 0
5. Positive(+Ve)supply voltage 11.1
6. DC volume control(electronic attenuator ) 1.5
7. De-emphases 6.6
8. Audio signal output 5.9
9. FM detector 4
10. FM detector 4
11. Not connected -
12. Audio output from driver section 4.8
13. Tone control 5.4
14. Input from audio driver section 0.6



IC IXO 365

Pin Details of IC IXO 365

Functions: Audio amplifier

Pin No Function Voltage
1. Ground (-Ve)supply voltage 0
2. Power amplifier output 5.9
3. Positive (+Ve)supply voltage 11.4
4. Not connected -
5. Filter 11.3
6. Decoupling capacitor 5.8
7. Decoupling capacitor 0.6
8. Audio input 0
9. Negative(-Ve) Feedback 0.5
10. input 0



IC HA 11662

Pin Details of IC HA 11662

Funtions : Horisontal oscillator and Phase detector

Pin No. Funtions Voltage
1. Not connected NC
2. Horizontal sub level (hold)(15625Hz.) -
3. Positive(Ve+)supply voltage 11.4
4. Horizontal Hold 5.4
5. Filter -
6. Filter 2.6
7. Filter -
8. Phase detector output 2.6
9. Phase detector input 2.3
10. Current limiting resistor 2.5
11. Sync input signal -1.3
12. Horizontal drive output 10
13. Horizontal drive ground 0
14. Ground(Ve-)supply voltage 0



IC IXO 238

Pin Details of IC IXO 238

Functions : Vertical Output

Pin No Functions Voltage
1. Ground(Ve-)supply voltage 0
2. Vertical output (50Hz.) 12.5
3. Vertical supply voltage to vertical section 23.5
4. Vertical input 0.8
5. Blanking(Flyback)pulse input 8.7
6. Positive(Ve+)supply voltage 23.5
7. Voltage (booster)output 9.6



Pin Details of IC KA 2107

Pin Details of IC KA 2107

Substitute : AN 5836

Finctions :

  1. DC volume control
  2. Tone control circuit
  3. Balace control
Pin No Functions Voltage
1. Balace control 6.2
2. Positive (+Ve)supply voltage 12
3. Right channel output 8.3
4. Right channel low frequency input 4
5. Bass control -
6. Right channel input 4
7. Ground (-Ve)supply voltage 0
8. Tone control -
9. Left channel input 4
10 Left channel output 8.3
11. Lift channel low frequency input 4
12. Volume control (electronic attenuator) -



Pin details of IC KA 2102A

Pin details of IC KA 2102A

Substitute : µPC 1353C


Funtions :

  1. Sound if and audio output
  2. FM detector
  3. Electronic attenuator
Pin No Function Voltage
1. Sqelch 9.8
2. FM detector coil 4.8
3. Electronic attenuator(decoupling capacitor) 5.9
4. Detected audio signal output from FM detector 5.2
5. Supply for sound IF section 8.4
6. Decoupling capacitor(for improving sound quality) 7.9
7. Detected audio signal input 3.8
8. Audio signal output to speaker 7.8
9. Bootstrap capacitor (to improve sound quality) 15.8
10. Positive supply(+Ve)for audio section 19.3
11. Feedback circuit(output to input)to improve sound quality 7.8
12. Sound IF signal input(Hot end)(5.5MHz.) 2.4
13. Sound IF signal input(Cold end)(5.5MHz.) 2.4
14. Volume control (electronic attenuator) 0.1



Pin details of IC KA 2102A

Pin details of IC KA 2102A


Substitute : µPC ൧൩൫൩ക്


Funtions :

  1. Sound if and audio output
  2. FM detector
  3. Electronic attenuator
Pin No Function Voltage
1. Sqelch 9.8
2. FM detector coil 4.8
3. Electronic attenuator(decoupling capacitor) 5.9
4. Detected audio signal output from FM detector 5.2
5. Supply for sound IF section 8.4
6. Decoupling capacitor(for improving sound quality) 7.9
7. Detected audio signal input 3.8
8. Audio signal output to speaker 7.8
9. Bootstrap capacitor (to improve sound quality) 15.8
10. Positive supply(+Ve)for audio section 19.3
11. Feedback circuit(output to input)to improve sound quality 7.8
12. Sound IF signal input(Hot end)(5.5MHz.) 2.4
13. Sound IF signal input(Cold end)(5.5MHz.) 2.4
14. Volume control (electronic attenuator) 0.1



Pin Details of IC IXO 388 CE

Pin Details of IC IXO 388 CE

Functions :

  1. Picture IF amplifier
  2. Video detector
  3. AFT
  4. Noise inverter
  5. Video pre-amplifier
  6. AGC generator
  7. Sound IF amplifier
  8. Audio detector,attenuator,and amplifier
Pin No Functions Voltage
1. RF AGC delay control 3.7
2. IF AGC filter 4.3
3. IF AGC filter 4.3
4. Positive(+Ve)supply voltage 11.9
5. AGC lookout protection 7
6. Ground(-Ve)supply voltage 0
7. By pass capacitor 4.1
8. Video IF signal input 4.1
9. Video IF signal input 4.1
10. By pass capacitor 4.1
11. Ground(-Ve)supply voltage 0
12. Audio attenuator(DC volume control) 5.1
13. Supply voltage (+Ve terminal for SIF) 11.9
14. Audio detector (frequency dettermining circuit) 7.1
15. Audio detector (frequency dettermining circuit) 5.7
16. By pass capacitor 6.4
17. Audio signal output 5.1
18. Sound IF input (5.5MHz. intercarrier sound) 4.7
19. By pass capacitor 7.5
20. Sound IF output (5.5MHz. intercarrier sound) 4.4
21. De-emphasis(frequency attenuator) 6.2
22. Not connected NC
23. Not connected NC
24. AFC output (15625Hz)for horizontal oscillator. 5.1
25. AFC detector frequency determining circuit(15625Hz.) 3.5
26. Video detector 5.9
27. Video detector 5.9
28. AFC detector frequency determining circuit(15625Hz.) 3.5
29. Video output 4.7
30. RF-AGC output for tunner(delayed AGC) 5



Pin details of IC IXO 304 CEZZ

Pin details of IC IXO 304 CEZZ

Substitute: µPC1420

Functions :

  1. Video amplifier
  2. AGC detector
  3. R-Y and B-Y demodulator
  4. G-Y matrix
  5. Sub carrier oscillator
  6. Burst gate and APC
  7. Sync separator
  8. Horizontal oscillator and drive
  9. Vertical oscillator and drive
  10. X-ray protection
Pin No Function Voltage
1. Ground (Ve-)supply voltage 0
2. Picture tone 4.9
3. 4.43MHz.Croma signal input to automatic colour control amplifier 5.4
4. ACC amplifier by-pass capacitor 7.6
5. 4.43MHz. Croma signal output for 1-H delay line 7.7
6. Sub colour control 5.7
7. R-Y Demulator input (delayed chroma signal) 5.4
8. Ground(Ve-)supply voltage 0
9. B-Y demulator input(delayed chroma signal) 5.9
10. Colour killer filter 7.7
11. B-Y colour diference signal output 7.1
12. R-Y colour diference signal output 7.1
13. G-Y colour diference signal output 7
14. Positive (Ve+)supply voltage 12
15. Sub carier oscillator(4.43MHz.)phase detector filter 6.3
16. Automatic phase control filter 6.1
17. Colour voltage controlled oscillator filter 8.7
18. Voltage controlled oscillator (4.43MHz.)filter 8.7
19.

PAL sub carrier phase adjusment

5.6
20. Subcarrier oscillator crystal(4.43MHz.) 5.2
21. DC feedback voltage for vertical driver 0.3
22. AC feedback voltage for vertical driver 3.4
23. Vertical frequency output (50Hz.) 0.9
24. Vertical drive ground 0
25. Horisontal drive ground 0
26. PAL/NTSC switch(ground)or X-ray protection 0.3
27. Horizontal frequency output(15625Hz.) 0.5
28. Low pass filter 7.1
29. Horizontal phase (automatic phase control) 6.3
30. Low pass filter 3.9
31. Oscillator filter 4.8
32. 32 fH Horizontal voltage controlled oscillator crystal(4.43MHz.) 4.8
33. 32 fH Horizontal voltage controlled oscillator crystal(4.43MHz.) 10
34. Killer switching out 8.1
35. Horizontal oscillator filter 7.1
36. TV / VIR switch 0
37. Sync separator input 8.1
38. Positive supply for horizontal section 12
39. Horizontal blanking input (15625Hz.) 0.7
40. Horizontal flyback pulses input(15625Hz.) for AFC 0.7
41. Contrast control 5.7
42. Video croma(colour signal)input 2.2
43. Video croma(colour signal)output 9.1
44. 4.43MHz. video input for video amplifier 9.4
45. Picture signal input for video amplifier 5.7
46. Brightness control 7.9
47. White level adjustment 0.1
48. Video (Y signal)output 6.7



Pin Details of IC HA 11485

Pin Details of IC HA 11485

Funtions:

  1. SIF Detector
  2. Video Amplifier
  3. FM Detector
  4. RF AGC
Pin No. Funtion Voltage
1. AFC Output 11.3
2. Ground(Ve -)supply voltage 0
3. RF AGC (Delayed AGC) 11.9
4. IF AGC (Keyed AGC) 4.6
5. Supply voltage for video IF amplifier 12.4
6. DC clamp(decoupling) 6.2
7. IF Filter 6.2
8. IF Filter 6.2
9. IF amplifier 6.2
10. Audio signal to drive to the speaker 3.6
11. Audio amplifier output 4.1
12. Tone control 4.1
13. FM Detector Input 2.1
14. Fm detector Coil 6.4
15. Fm detector coil 10.8
16. Audio amplifier 3.1
17. Audio signal output 3.1
18. Sound IF output 3.7
19. Limiter amplifier filter 3.1
20. Limiter amplifier Input 3.1
21. Feedback 3.1
22. Supply voltage for sound IF amplifier 12
23. AFT 7.9
24. AFT 7.9
25. AFT 7.9
26. AFT 0
27. Video Detector coil 5.2
28. Video detector coil 5
29. RF AGC Control(delayed AGC) 4.4
30 AGC Filter(5.5 MHz) 6.4



Pin Details of IC A220 D

Pin Details of IC A220 D

Substitute : TBA120S , SN76620

Functions :

  1. Sound IF amplifier
  2. FM detector
  3. AF detector
Pin No. FunctionVoltage
1.Ground (-Ve)supply voltage 0
2.Decoupling capacitor 1.9
3.Ground (-Ve)supply voltage 0
4.Ground (-Ve)supply voltage 0
5.Volume control (electronic attenuator) 3.8
6.FM detector -
7.FM detector3.3
8.Audio output 4
9.FM detector3.3
10.FM detector-
11.Positive(+Ve)supply voltage 11
12.Ground (-Ve)supply voltage 0
13.Decoupling capasitor 1.9
14.Sound IF input (5.5Hz.) 1.9



IC HA 11440

Pin Details of IC HA 11440

Functions :

  1. IF amplifier
  2. AGC detector
  3. RF AGC amplifier
  4. Video detector and amplifier
  5. automatic frequency tuning (AFT)detector
Pin No. FunctionVoltage
1.Composite colour video signal output 8
2.Ground(-Ve)suppy voltage 0
3.AFT detector(tuning circuit) 4.5
4.Video detector(tuning circuit) 8.4
5.Video detector(tuning circuit) 8
6.AFT detector(frequency tuning circuit) 4.5
7.AFT detector capasitor (noise canceller) 0
8.AFT output for tuner 8.3
9.Positive(+Ve)supply voltage 12.1
10.RF AGC signal output for tuner 2.8
11.Decoupling capacitor for biasing 5.3
12.IF signal input to IF amplifier 5.3
13.IF signal input to IF amplifier 5.3
14.Decoupling capacitor for biasing 5.4
15.AGC detector 3.5
16.RF AGC control 4.5



IC HA 11423

Pin Details of IC HA 11423

Functions :

  1. Horizontal AFC Sync separator
  2. Horizontal oscillator
  3. X-Radiation protector
  4. Vertical blanking and pulse generator
Pin No. FunctionVoltage
1.Vertical driver (50Hz) 1.1
2.Vertical output feedback 3.8
3.Vertical oscillator frequency determining capacitor(50Hz) 6.6
4.Vertical oscillator feedback(50Hz) 3.8
5.Supply voltage for vertical oscillator 11.2
6.Vertical hold control 4.5
7.Vertical sync input(50Hz) 4.5
8.Sync output 1
9.Sync separator biasing 5.7
10.Copmposite video signal input6
11.Flyback pulse input for phase detector 3.6
12.Phase detector voltage output6.7
13.Horizontal oscillator(50Hz) 6.7
14.Positive(+Ve)sipply voltage 12.6
15.Horizontal drive output 0.8
16.Hold down input 0
17.Vertical blanking pulse output(50Hz) 0.1
18Ground (-Ve)supply voltage 0



IC HA 11423

Pin Details of IC HA 11423

Functions :

  1. Horizontal AFC Sync separator
  2. Horizontal oscillator
  3. X-Radiation protector
  4. Vertical blanking and pulse generator
Pin No. FunctionVoltage
1.Vertical driver (50Hz) 1.1
2.Vertical output feedback 3.8
3.Vertical oscillator frequency determining capacitor(50Hz) 6.6
4.Vertical oscillator feedback(50Hz) 3.8
5.Supply voltage for vertical oscillator 11.2
6.Vertical hold control 4.5
7.Vertical sync input(50Hz) 4.5
8.Sync output 1
9.Sync separator biasing 5.7
10.Copmposite video signal input6
11.Flyback pulse input for phase detector 3.6
12.Phase detector voltage output6.7
13.Horizontal oscillator(50Hz) 6.7
14.Positive(+Ve)sipply voltage 12.6
15.Horizontal drive output 0.8
16.Hold down input 0
17.Vertical blanking pulse output(50Hz) 0.1
18Ground (-Ve)supply voltage 0



IC HA 11244

Pin Details of IC HA 11244

Functions :

  1. Horizontal phase detector(AFC)
  2. Horizontal & Vertical oscillator
  3. Horizontal & Vertical driver amplifier
Pin No. FunctionVoltage
1.Vertical amplifier(50Hz.) 3.9
2.Vertical output(50Hz.) 1
3.Negative(-Ve) feedback(output to input) 3.8
4.Positive(+Ve)feedback for vertical oscillator 3.5
5.Vertical oscillator(50Hz.) 6.4
6.Internally connected 10.6
7.Vertical oscillator frequency determining circuit 4.6
8.Vertical sync pulse input to vertical oscilator(50Hz.) 10.2
9.Ground (-Ve)supply voltage 0
10.Horizontal frequency (15625Hz.)adjustment(H-Hold)1.8
11.Positive (+Ve)supply voltage 12.6
12.Horizontal frequency (15625Hz.)adjustment(H-Hold)6.4
13.Horizt.oscillator time constant circuit & Horzt.sync pulse(15625Hz)input0
14.Horizontal flyback (blanking)pulse from EHT(15625Hz) 2.9
15.Phase detector (AFC)output for horizontal oscillator(15625Hz) 6.4
16.Horizontal sync signal input for horizontal AFC (15625Hz) 12.1



IC HA 11235

Pin Details of IC HA 11235

Functions:

  1. Sync separator
  2. Horizontal AFC
  3. Horizontal oscillator
  4. Horizontal output
  5. Vertical oscillator
  6. Vertical driver
Pin No. FunctionVoltage
1.Vertical driver(50Hz.) 3
2.Vertical driver(50Hz.) 0.7
3.Heigh control(vertical) 3
4.Vertical oscillator(50Hz.) 3.6
5.Vertical oscillator(50Hz.)6.6
6.Vertical supply voltage 11
7.Vertical trigger(vertical sync pulse input)(50Hz.) 4.2
8.Vertical oscillator(hold control)(50Hz.) 4.2
9.Horizontal ground(-Ve)supply voltage 0
10.Horizontal output(15625Hz.) 0.4
11.Positive(+Ve)supply voltage 12.7
12.Horizontal oscillator(15625Hz.) 6.8
13.Flyback pulse input(15625Hz. from EHT) 3.6
14.Phase detector DC control voltage(output)AFC6.8
15.Composite video signal(input) 12.7
16.Sync pulse(output) 1.5
17.Sync pulse(output) 4.4
18.Ground (-Ve)supply voltage 0



IC HA 11229

Pin Details of IC HA 11229

Functions : Sound IF amplifier

Pin No.FunctionVoltage
1.Sound IF amplifier input 3.3
2.Decoupling capacitor 3.3
3.Sound IF input 3.3
4.Bias circuit 5.4
5.Sound IF amplifier output 5.2
6.Not connected NC
7.Ground (-Ve)supply voltage 0
8.Detected output signal 3.1
9.Not connected NC
10.Buffer(output stage)amplifier output 2.4
11.Detector coil 3.4
12.Detector coil 4.1
13.Ground (-Ve)supply voltage 0
14Positive (+Ve)supply voltage 5.6



IC HA 11228

Pin Details of IC HA 11228

Functions :

  1. IF AGC amplifier
  2. RF AGC amplifier
  3. PIF amplifier
Pin No. FunctionsVoltage
1.Video IF coil 9.3
2.Positive(+Ve)supply voltage(vcc1) 11.4
3.Video IF amplifier variactor(variable voltage) -
4.Video IF amplifier variactor(variable voltage)-
5.Positive(+Ve)supply voltage(vcc2) 11.4
6.IF AGC control (keyed AGC) 10.6
7.Ground (-Ve)supply voltage 0
8.IF AGC amplifier input (keyed AGC) 1.5 to 8
9.Tuner supply voltage 10.5 to 11
10.Not connected NC
11.RF AGC amplifier(delayed AGC) 3.5 to 7
12.Video amplifier input 5.2
13.Video amplifier input 5.2
14.Video IF coil 9.3



IC HA 11107

Pin Details of IC HA 11107

Functions :

  1. Sound IF amplifier
  2. FM detector
  3. Electronic attenuator
  4. AF pre-amplifier
Pin No. FunctionVoltage
1.Sound IF input(5.5MHz.) 1.9
2.Sound IF input(5.5MHz.) 1.9
3.Ground supply voltage 0
4.DC volume control (electronic attenuator) 0.8
5.Positive(+Ve)supply voltage 11.1
6.DC volume control (electronic attenuator)4.8
7.De-emphasis (frequensy attenuator) 6.6
8.Audio signal output 5.9
9.FM detector 4
10.FM detector 4
11.Not connected NC
12.Audio output from driver 4.2
13.Tone control 5.4
14.Input for audio driver section 1.5



IC HA 1440 A

Pin Details of IC HA 1440 A

Functions :

  1. RF AGC
  2. AGC Detector
  3. Video detector
  4. AFT Detector
Pin No. FunctionVoltage
1.Amplifier output 7.9
2.Ground (-Ve)supply voltage 0
3.AFT detector coil 4.6
4.Video detector coil 8
5.Video detector coil 8
6.AFT detector input 4.6
7.AFT detector switch -
8.AFT detector output -
9.Positive(+Ve)supply voltage 12
10.RF AGC output (delayed AGC) -
11.Decoupling capacitor 5.4
12.IF amplifier input 5.4
13.IF amplifier input 5.4
14.Decoupling capacitor 5.5
15.AGC decoupling capacitor 3.3
16.RF AGC (delayed AGC) 4.3



IC HA 1389

Pin Details of IC HA 1389

Functions : Sound driver and Audio output amplifier

Pin No. FunctionVoltage
1.Ground (-Ve)supply voltage 0
2.Audio frequency output(audio signal output to speaker) 12.3
3.Positive(+Ve)supply voltage(main supply voltage) 24
4.Supply voltage for audio output stage 24
5.Supply voltage for audio driver 23
6.Feedback(out to input)to improve sound quality 0.7
7.Capacitor(to minimise distortion) 1.3
8.Capacitor(to minimise distortion) 12
9.Audio signal input from sound IF section 0
10Audio driver ground 0



IC HA 1364

Pin Details of IC HA 1364

Functions :

  1. Sound IF amplifier
  2. FM detector
  3. DC volume control
  4. Audio amplifier
Pin No. FunctionVoltage
1.Sound IF amplifier input 3.5
2.Decoupling capasitor for biasing of sound IF amplifier 3.5
3.Sound IF amplifier 3.5
4.FM detector tuning circuit 3
5.FM detector tuning circuit 3
6.DC volume control(electronic attenuator) 2 to 4.5
7.AF amplifier 10
8.AF amplifier 1
9.Audio signal output from audio amplifier 9.9
10.Positive supply voltage 20
11.AF amplifier 10
12.DC volume control(electronic attenuator) 10



IC HA 1167

Pin Details of IC HA 1167

Functions :

  1. Video amplifier
  2. Sync separator
  3. AFC
Pin No. FunctionsVoltage
1.Video IF amplifier 1.8
2.Ground (-Ve)supply volyage 0
3.Video IF amplifier output 2.5
4.Video detector amplifier input 2.5
5.Noise cancellor 2.6
6.Noise cancellor 2.6
7.Sync separator coil 2.8
8.AGC output 1.5 to 8
9.AGC coil 11.2
10.Sync output pulse 2
11.Positive(+Ve)supply voltage 11.4
12.Noise cancellor input 2.5
13.Video amplifier output signal 6
14.Video amplifier input 0.4
15.Video amplifier input 2.5
16.Video detector amplifier output 2.5



IC HA 1144

Pin Details of IC HA 1144

Functions :

  1. IF AGC Amplifier
  2. RF AGC Amplifier
  3. PIF Amplifier
Pin No. FunctionVoltage
1.Video IF coil
2.Positive(+Ve)supply voltage(VCC1)
3.Video IF amplifier variactor(variable voltage)
4.Video IF amplifier variactor(variable voltage)
5.Positive(+Ve)supply voltage(VCC2)
6.IF AGC Control(Keyed AGC)
7.Ground(-Ve)supply voltage
8.IF AGC amplifier input (keyed AGC)
9.Tuner supply voltage
10.Not Connected
11.RF AGC amplifier (keyed AGC)
12.Video IF amplifier input
13.Video IF amplifier input
14Video IF coil



IC HA 1128

Pin Details of IC HA 1128

Functions : Sound IF ,Sound Detector and amplifier

Pin No. FunctionVoltage
1.IF amplifier(Limiter) 2
2.IF amplifier input 2
3.Ground for IF amplifier (Limiter) 0
4.Ground(-Ve)supply voltage 0
5.Positive(+Ve)supply voltage 11.3
6.Electronic Attenuator(DC volume control) 4.7
7.Sound signal input 6.4
8.Buffer(output stage) 5.7
9.Compensation3.9
10.FM detector 3.9
11.Not Connected NC
12.Audio driver output 5.3
13.To speaker 5.9
14.Audio driver input 1.6



IC HA 1126

Pin Details of IC HA 1126

Substitute : M5135P , LA1364 , TA7070

Functions : DC amplifier and IF amplifier

Pin No. FunctionVoltage
1.Not Connected NC
2.Not Connected NC
3.Discriminator input(APC) 1.3
4.IF amplifier output 11.5
5.Discriminator input(APC)1.3
6.Not Connected NC
7.DC amplifier output 11.5
8.DC amplifier output2.3
9.Not Connected NC
10.Decoupling capacitor 1.3
11.IF amplifier input 1.2
12.Not Connected NC
13.Ground (-Ve)supply voltage 0
14Positive (+Ve)supply voltage 11.5



IC HA 1125

Pin Details of IC HA 1125

Substitute

CA3065 , AN241 , TA7176 ,KA2101 ,LA1365 , LM3065 , MC1358 , ULN2165

Functions :

Sound amplifier limiter,Low pass filter,FM detector and AF amplifier.

Pin No. FunctionVoltage
1.Sound IF input (5.5 MHz. Inter carrier sound) 1.9
2.Sound IF input (5.5 MHz. Inter carrier sound) 1.9
3.Sound IF ground 0
4.Ground (-Ve supply voltage ) 0
5.Positive (+Ve supply voltage ) 11.1
6.DC volume control (electronic attenuator) 1.5
7.De-emphasis 6.6
8.Audio signal output 5.9
9.FM Detector 4
10.FM Detector 4
11.Not Connected NC
12.Audio out from driver section 4.8
13.Tone control 5.4
14.Input from audio driver section 0.6



IC GL-3401

Pin Details of IC GL-3401

Substitude: HA 11423

Functions:

  1. Sync separator
  2. Harizontal AFC
  3. Horisontal oscillator
  4. Horizontal output (pre-amplifier)
  5. X-ray protection
  6. Vertical oscillator
  7. Vertical driver
  8. Vertical blanking generator
Pin No. FunctionVoltage
1.Vertical blanking pulses output(50Hz.) 5.6
2.Vertical pulse(50Hz.)output 1.1
3.Not Connected NC
4.Vertical driver 3.8
5.Vertical oscillator (50hZ.) 6.6
6.Vertical feedback(output to input) 3.8
7.Positive (+Ve)supply for vertical section in IC 11.2
8.Vertical oscillator (50hZ.) 4
9.Not Connected NC
10.Vertical sync or trigger(50Hz.) 4
11.Vertical sync output(50Hz.) 1
12.Ground (-Ve supply voltage) 0
13.Sync separator 3
14.Sync signal input 3.2
15.Sync signal input 3.2
16.15625Hz.Flyback (blanking)pulse input(AFC) 2.8
17.15625HZ.controlled voltage to horizontal oscillator 5.9
18.Horizontal oscillator(15625Hz.) 5.4
19.Positive (+Ve)supply for horizotal section 10.2
20.Horizontal frequency output(15625Hz.) 2
21.Not Connected
22.Not Connected
23.Not Connected
24Ground (it is also used for X-ray triggering circuit)(Fail safe)



IC GL 1146

Pin Details of IC GL 1146

Substitude : TBA 810 P

Functions :

  1. AF Pre-amplifier
  2. AF Driver
  3. AF Output
Pin No. FunctionsVoltage
1.Positive(+Ve)supply voltage 12
2.Not Connected -
3.Not Connected -
4.Bootstrap12
5.Compensation0.6
6.Negative feedback (output to input) 1.4
7.Ripple rejection 6.2
8.Audio input 0.3
9.Ground (Substrate) 0
10.Ground(-Ve)supply voltage 0
11.Not Connected -
12.Audio signal output 6.5



IC CXA 1001 AP

Pin Details of IC CXA 1001 AP

Functions :

  1. Chroma amplifier
  2. ACC amplifier
  3. Burst Gate
  4. Voltage Controlled Oscillator
  5. RGB Matrix
  6. R-Y & B-Y Demolator
  7. RGB output
  8. Ident Detector
  9. Colour Killer
Pin No. FunctionsVoltage
1.Positive(+Ve)supply voltage 12
2.ACC AAmplifier input 0.6
3.Aoutomatic colour control 3.9
4.Aoutomatic colour control 0.2
5.Ident control 5.8
6.Picture Matrix output 4.9
7.Signal switch (hue control) 8.2
8.Picture matrix input by colour control 6
9.B-Y Demodulator input Through signal switch 7.6
10.R-Y Demodulator input Through signal switch7.6
11.Phase Detector 7.9
12.Voltage controlled oscillator (4.43MHz.) 7.9
13.Voltage controlled oscillator switch 3.5
14.Hue control switch 10.1
15.Crystal switch 3.5
16.Phase control 7.1
17.Voltage controlled oscillator switch 3.9
18.Hue control switch 6.8
19.VCO Frequency Determining Crystal 9.6
20.Positive(+Ve)supply voltage 12
21.Hue control0-2.4
22.Signal switch 9.7
23.Red colour clamp capacitor 10
24.Green colour clamp capacitor 10.1
25.Ground (-Ve supply voltage) 0
26.Blue colour clamp capacitor 10.1
27.Blue colour output 2
28.Green colour output 2
29.Red colour output 2.1
30.Burst control 3.9
31.Clamp capacitor 8.9
32.SHP input 2.5
33.Picture (Y- signal ) output 10.1
34.SHF6
35.Y-signal input for picture amplifier 3.7
36.Picture (Luminance)amplifier 6.5
37.Burst gate input 0
38.Horison sync pulse(15625Hz.) 0.1
39.Vertical blanking input(50Hz.) 0.5
40.Burst gate pulse output 0
41.Horizontal flyback(blanking)input from EHT 1.3
42.gROUND (-Ve terminal) 0



Pin Details of IC CX 20015

Pin Details of IC CX 20015

Functions :

  1. Video IF amplifier
  2. FM Detector
  3. AGC Amplifier
  4. Sound IF amplifier
Pin No. FunctionVoltage
1.IF amplifier input 3.2
2.IF amplifier input3.2
3.Ground (-Ve supply voltage) 0
4.RF AGC Amplifier input 4.9
5.AFT up/Down input 8.9
6.AFT up/Down output -
7.Compensation4.6
8.FM detector 7.1
9.FM detector 7.1
10.Volume control(electric attenuator) 0
11.Volume control amplifier output 3.5
12.Volume control amplifier input 3.8
13.FM detector output 4
14.90° phase shift 0
15.Volume control(electric attenuator)0
16.Ground (-Ve supply voltage) 0
17.BIF Amplifier input 4.8
18.BIF Amplifier input 4.8
19.Decoupling capacitor 9
20.Aoutomatic Noise Canceller 3.8
21.Positive(+Ve supply voltage) 9
22.Horison amplifier 4
23.Horison amplifier4
24.AM Detector input -
25.AM Detector input -
26.AGC Driver output 6.8
27.AGC Driver input 6.7
28.RF AGC Amplifier output 4.2



IC CX 175

Pin Details of IC CX 175

Functions :

  1. Gain controlled amplifier
  2. B-Y and R-Y multipier
  3. 2nd limiter and top limiter
  4. Pulse shaper and killer circuit
Pin No. FunctionVoltage
1.Top limiter 11.1
2.2nd limiter and switches 2.4
3.2nd limiter and switches0.3
4.R-Y Multiplier 6.3
5.R-Y Multiplier 6.3
6.R-Y Multiplier 12
7.Positive(+Ve supply voltage) 12
8.R-Y output 5.6
9.Ground(-Ve supply voltage) 0
10.Pulse shaper input 0.6
11.Clamp capacitor 5.8
12.automatic stereo/mono switch 7.1
13.Bias coupling 5.8
14.Sampling integartor output 6.5
15.Killer output 12
16.Sampling output 6.9
17.B-Y signal output 5.6
18.Positive (+Ve supply voltage) 12.
19.Picture matrix input 3.7
20.Decoupling capacitor for biasing 12
21.Decoupling capacitor for biasing6.3
22.Not Connected -
23.Top limiter input 2.7
24.Top limiter input2.7



IC CX 157

Pin Details of IC CX 157

Functions :

  1. Vertical Trigger
  2. Vertical Oscillator
  3. Vertical Driver
Pin No. FunctionsVoltage
1.Not Connective NC
2.Not ConnectiveNC
3.Vertical oscillator(50Hz.) 7.7
4.Vertical oscillator(50Hz.)4.7
5.Positive(+Ve supply voltage) 12
6.Ground (-Ve supply voltage) 0
7.Ground (-Ve supply voltage) 0
8.Ground (-Ve supply voltage) 0
9.Negative feedback (output to input) 2.2
10.Vertical Driver output(50Hz) 0.9
11.Vertical sync pulses input(50Hz.) 7
12.Vertical Driver output(50Hz) -0.1
13.Not ConnectiveNC
14.Not ConnectiveNC



Pin Details of IC CX 109

Pin Details of IC CX 109

Functions :

  1. Video IF
  2. Sound IF
  3. AFT
  4. Luminance(Y)amplifier
  5. Chroma Demodulator
  6. AGC
  7. Regulator
Pin No. FunctionsVoltage
1.DC amplifier 0.2
2.DC amplifier output 3.7
3.Not Connected NC
4.ACC Ident & Killer detector output 5.7
5.Pulse shaper input 1
6.Pulse shaper input -
7.Positive(+Ve supply voltage) 12
8.Clamping10.5
9.Blue blanking(flyback)output 6
10.Green blanking(flyback)output 5.9
11.Matrix amplifier input 10.5
12.Red blanking(flyback)output 6
13.Chroma demodulator input 11
14.Ground (-Ve supply voltage) 0
15.Chroma demodulator input 3
16.Chroma demodulator input 3
17.Positive(+Ve supply voltage) 12
18.Chroma demodulator input 4.5
19.Carrier wave switch 4.5
20.Carrier wave switch4.5
21.Flip flop(PAL Switch)output -
22.Pulse shaper (Burst Blanking) 0.8
23.Pulse shaper (Burst Blanking)0
24.Pulse shaper Output 0.3



Pin Details of IC CX 108

Pin Details of IC CX 108

Functions : Luminace(Y)amplifier/Chroma

Pin No. FunctionsVoltage
1.Automatic Colour Control input 0.7
2.Automatic Colour Killir input3.7
3.Decoupling Capacitor 2.8
4.Supply to oscillator (4.43MHz.) 12
5.Pulse shaper input 0.3
6.Oscillator input 3.8
7.Reference input 12
8.Oscillator (4.43MHz.) 12
9.Compensation7.2
10.Variable Reactance 7.2
11.Phase detector input 6
12.Ground (-Ve supply voltage) 0
13.Chroma amplifier 12
14.DC Variable Reactance imput 1.5
15.Sharpness control 2.1
16.Decoupling Capacitor 7.9
17.Brighness control 5.4
18.Decoupling Capacitor10
19.Brighness control 1.3
20.Positive (+Ve supply voltage) 12
21.Sharp output pulse 11.7
22.Luminance(Y) Amplifier output 4.3
23.Aoutomatic Colour control (killer)output 0.1
24.Luminance(Y)amplifier input 4



Pin Details of IC CX 095 C

Pin Details of IC CX 095 C

Functions :

  1. Sound IF
  2. SIF Detector
  3. AF Driver
Pin No. FunctionVoltage
1.FM Detector Output 5.4
2.FM Detector 3.8
3.FM Detector 3.8
4.Not Connected NC
5.AF Drive Output 3.8
6.AF drive input 5
7.AF drive input 1.2
8.Decoupling Capacitor 2.2
9.Sound IF input 2.2
10.Ground(-Ve supply voltage) 0
11.AF Drive input 1.1
12.Positive (+Ve supply voltage) 11.2
13.AF drive input 2.3
14.Decoupling Capacitor 7.2



Pin Details of IC CA 7611

Pin Details of IC CA 7611

Functions :

  1. Video IF ampliefier
  2. IF AGC
  3. Video detector
  4. Video ampliefier
  5. Video Drivers
Pin No. FunctionVoltage
1.IF Signal input 3
2.Decoupling capacitor 3.8
3.AGC Delayed Control 6.4
4.AGC Control voltage for RF tuner 2.7
5.AFC Output amplifier 10.5
6.AFT Detector -
7.AFT Detector -
8.IF Limiter 6
9.IF Limiter 6
10.AFT Detector -
11.Positive supply voltage 10.5
12.Detected video signal output 5
13.Ground (-Ve supply voltage) 0
14.AGC detector/VCR switch 7
15.Decoupling capasitor 3.8
16.IF Signal input 3



Pin details of IC CA 3223

Pin details of IC CA 3223

Functions:

  1. Horisontal AFC or phase comparator
  2. Horisontal oscillator
  3. Vertical oscillator
  4. Vertical Pre-amplifier
  5. Sandcastle pulse generator
  6. To facilitate acceptance of non standard signal generated by equipments like VCR
Pin No. FunctionsVoltage
1.Horisontal sync pulses(input)to horisontal phase detector loop 0.2
2.Skew swith 0.1
3.Filter for Horz.oscillator sync loop 1 1.8
4.Tank circuit for horisontal oscillator (15625Hz.) 9.5
5.Supply(positive terminal) 9.5
6.Flyback (15625Hz.)sense (input)to Horz.phase detector loop 2 -0.2
7.Regulator drive 8.5
8.Ground (Negative terminal) 0
9.For built-in voltage regulator control circuit,the error amplifier's output is available at pin no.9 0
10.B+sense0
11.Internal reference DC voltage (size comparator) 0
12.Horizontal ramp capacitor 2
13.Filter for harizontal oscillator synchronisation loop 2 1.2
14.Duty cycle sense (Horizontal section) 2
15.Duty cycle sense (Horizontal section) 2.2
16.(15625Hz.)Horizontal scan frequency(Output) 0.5
17.Supp;y(+Ve terminal)for vert,driver 9.5
18.(50Hz.)Horizontal scan frequency(Output) 1
19.Vertical feedback(Output to input) 12
20.Vertical input(50Hz.) 0.8
21.Vertical ramp(frequency adjust network) 3.5
22."S" shaping(for linearity purpose) 12
23.Vertical blanking (Output) for sandcastle pulse generation 1.5



IC CA 3194

Pin Details of IC CA3194

Functions : Luminance and Chrominance (Video and colour )

Pin No. FunctionVoltage
1.Ground(-Ve terminal ) 0
2.Regulated chroma output(colour) 8.5
3.Saturation control is connected externally to this pin.The pin 3 voltage is clamped to 0V during colour killing conditions 0 to 5
4.Chroma signal input to chroma amplifier with AGC 2.1
5.Output of sample and hold circuit which samples the outputs from the burst gate PAL ident flip flops 0.3
6.Automatic colour gain control capacitor 8.6
7.Automatic phase control capacitor 8.3
8.The output of the sample and hold circuit for the reference 10.6
9.90° shifted reference oscillator frequncy input 6.9
10.Reference oscillator frequency input without any phase shift 2.6
11.Reference oscillator output 3.5
12.Positive supply(+Ve terminal) 12
13.Input pin for sandcastle pulse 0.1
14.Input for U or (B-Y)signal 3.5
15.Input for V or (R-Y)signal 3.5
16.Blue colour signal output 5 to 7.4
17.Green colour signal output 5 to 7.4
18.Red colour signal output 5 to 7.4
19.Input for peak beam limit information 1.8
20.Y or luminance signal input to luminance amplifier 1.8
21.Clamp capacitor 10.2
22.Contrast control (connected externally)varies bias of this pin 0.5 to 3.5
23.Brighness control input 0 to 8
24.Input for average beam current limit information 1.8



 
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